Atrenta and TSMC Announce SpyGlass® IP Kit 2.0 Availability.

     New soft IP qualification platform more comprehensive and easier to use

SAN JOSE, Calif and HSINCHU, Taiwan, R.O.C. — Oct 31, 2012 — Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, with TSMC announced today the planned availability of IP Kit 2.0. Based on the SpyGlass® RTL design platform, IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft, or synthesizable IP. IP Kit 2.0 has undergone extensive beta testing by TSMC soft IP alliance partners: Digital Media Professionals Inc., Dolphin Integration, Sonics, Inc. and Vivante Corporation. IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance partners on Nov. 20, 2012.

Originally announced on May 26, 2011, TSMC’s soft IP quality assessment program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass checks that create detailed reports of the completeness and robustness of soft IP. Currently, over 15 soft IP suppliers have been qualified through the program. IP Kit 2.0 represents an enhanced set of checks that adds physical implementation data (e.g., area, timing and congestion) and advanced formal lint checks (e.g., X-assignment, dead code detection). IP Kit 2.0 also allows easier integration into the end user’s design flow and enhanced IP packaging options.

“The predictability of soft IP reuse continues to be a challenge for the SoC design community,” said Mike Gianfagna, vice president of corporate marketing at Atrenta. “Thanks to TSMC’s commitment to drive the quality of soft IP deliverables, we are making real progress toward improving soft IP reuse.”

“The soft IP9000 program has already had a positive impact on the delivered quality of soft IP for TSMC’s customers. The addition of physical implementation information and formal lint analysis will further enhance the effectiveness of the program,” said Suk Lee, senior director, Design Infrastructure Marketing Division at TSMC. “The beta test program went very smoothly. IP Kit 2.0 installed easily and ran with minimal issues during the beta test period for our selected soft IP alliance partners.”

IP Kit 2.0 is available from Atrenta. Admission into the soft IP qualification program is managed by TSMC. Contact Richard Lee ( for further information on the program.

More information about the soft IP alliance partners who participated in the beta test program for IP Kit 2.0 is available on the accompanying sheet.


About Atrenta

Atrenta’s SpyGlass® Predictive Analysis software platform significantly improves design efficiency for the world’s leading semiconductor and consumer electronics companies. Patented solutions provide early design insight into the demanding performance, power and area requirements of the complex system on chips (SoCs) fueling today’s consumer electronics revolution. More than two hundred companies and thousands of design engineers worldwide rely on SpyGlass to reduce risk and cost before traditional EDA tools are deployed. SpyGlass functions like an interactive guidance system for design engineers and managers, finding the fastest and least expensive path to implementation for complex SoCs. SpyGlass from Atrenta: Insight. Efficiency. Confidence.

About Vivante Corporation

Vivante Corporation, a leader in multi-core GPU, OpenCL™, and 2D Composition IP solutions, provides the highest performance and lowest power characteristics across a range of Khronos™ Group API conformant standards based on the ScalarMorphic™ architecture. Vivante GPUs are integrated into customer silicon solutions in mass market products including smartphones, tablets, HDTVs, consumer electronics and embedded devices, running thousands of graphics applications across multiple operating systems and software platforms. Vivante is a privately held company headquartered in Sunnyvale, California, with additional R&D centers in Shanghai and Chengdu. For more information, visit